Articles from Faraday Technology Corporation

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today highlighted its 40uLP SONOS embedded non-volatile memory (eNVM) solution, offering MCU vendors a cost-efficient alternative to NOR Flash while ensuring stable memory supply for long-lifecycle applications.

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design and IP provider, today announced the continued expansion of its IP product lines on UMC’s 14nm FinFET Compact (14FCC) platform, covering USB 2.0/USB 3.2 Gen1 PHY, LVDS TX/RX I/O, DDR 3/4 combo PHY (up to 4.2 Gbps), and LPDDR 4/4X/5 PHY (up to 6.4 Gbps). Leveraging UMC’s 14nm platform, these IP solutions deliver an ideal balance of performance, power consumption, and cost, making them well suited for applications such as industrial control, AIoT, networking, smart displays, multi-function printers (MFP), and edge AI.

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design and IP provider, today announced the availability of its DDR/LPDDR combo PHY, supporting from 3rd to 5th-generation on UMC’s 22ULP and 14FFC platforms, which are UMC’s planar and FinFET process technologies. Faraday continues its long-standing commitment to delivering in-house IP solutions optimized to better serve the ASIC market.

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the availability of its 10G SerDes IP on UMC’s 22nm process technology. Designed to meet the increasing demands of high-speed data transmission, the new SerDes IP supports a broad range of industry-standard protocols and is optimized for applications in industrial automation, AIoT, 5G modems, fiber-to-the-home (FTTH), and advanced networking.

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today introduced its latest FlashKit™ development platform, FlashKit™-22RRAM, designed to accelerate high-performance IoT and MCU applications. Built on UMC’s 22ULP process, FlashKit™-22RRAM combines embedded Resistive RAM (RRAM, ReRAM) technology with a rich IP ecosystem and development-ready support, providing a cost-effective and power-efficient SoC solution for edge devices.

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announces the launch of its latest SoC platform, HiSpeedKit™-HS, designed to enhance and streamline the verification process for high-speed interface IP subsystems. The platform supports Faraday’s and third-party controller IP solutions, enabling comprehensive hardware and software verification through FPGA integrated with HiSpeedKit-HS.

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, and Kiwimoore, a global leader in AI networking full-stack interconnect products and solutions, announced today that their jointly developed 2.5D packaging platform has successfully entered the mass production stage. The one-stop advanced packaging platform and service developed through collaboration between Faraday and Kiwimoore, which incorporates Kiwimoore’s Chiplet interconnect and NDSA (network domain specific accelerator) solutions, highlight the significant achievements both companies have made in the Chiplet market.

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today introduced its advanced packaging coordinated platform for the vertical disintegration of chiplets. This unique platform streamlines the advanced packaging processes by integrating multiple vendors and multi-source chiplets and provides three core advanced packaging services - design, packaging, and production.

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced that its MIPI D-PHY and V-by-One (VBO) PHY IP portfolios now support processes that range from 55nm to 22nm on UMC platform. Faraday has shipped over 100 million video interface IP solutions for AIoT, industrial, consumer, and automotive applications, which includes ASIC and IP business models.

Faraday Technology Corporation (TWSE: 3035), a leader in ASIC design services and IP solutions, announces joining the Intel Foundry Accelerator Design Services, marking a significant milestone in advancing ASIC design solutions for next-generation applications, including artificial intelligence (AI), high-performance computing (HPC), and AI-enabled vehicles. This participation in the alliance underscores a shared commitment to innovation and customer success.

Faraday Technology Corporation (TWSE: 3035), a leading provider of ASIC design services and IP solutions, announced it is leveraging the latest Arm® Automotive Enhanced (AE) technology, licensing the Cortex®-A720AE IP to drive the development of AI-enabled vehicles ASICs, with a focus on safety, efficiency, and quality.

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, announced today the successful mass production of Sonix’s application-specific MCU chips using UMC 40ULP process node. Sonix adopted Faraday’s SONOS eFlash subsystem, which is specially designed to develop edge AI, smart grid, IoT, and MCU applications, to facilitate the integration of the eFlash function into the SoC without modifying the existing proven IP at 40ULP.

Faraday Technology Corporation (TWSE: 3035), a leader in ASIC design services and IP solutions, announces its collaboration with Arm and Intel in spearheading the development of a 64-core System-on-Chip (SoC) utilizing Intel 18A technology. This innovative SoC seamlessly integrates Arm® Neoverse™ Compute Subsystems (CSS), delivering unparalleled performance and power efficiency tailored for the construction of scalable hyperscale datacenters, infrastructure edge, and advanced 5G networks.

Faraday Technology Corporation (TWSE: 3035), a leader in ASIC design services and IP solutions, announces its participation as a design service partner in Arm® Total Design, underscoring the importance of Faraday's design proficiency and commitment to resources for Arm-based solutions. By leveraging Arm Neoverse™ Compute Subsystems (CSS), Faraday is poised to deliver cutting-edge cloud, high-performance computing (HPC), and AI chips with unparalleled performance and innovation.

Faraday Technology Corporation (TWSE: 3035), a leader in ASIC design services and IP solutions, announces the availability of its 4-port Gigabit Ethernet PHY on UMC's 28HPC+ process. This silicon-proven GPHY features an SAR ADC for superior PPA advantages and an advanced digital algorithm that significantly enhances SNR (signal-to-noise ratio). Designed to meet the growing demands for highly integrated SoC solutions in networking, consumer, and industrial automation applications, Faraday's latest offering aims to expedite product development while boosting performance.

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the launch of its 2.5D/3D advanced package service. With an unique interposer manufacturing service for chiplets connection and close collaboration with top-tier foundry and OSAT suppliers to secure capacity, yield, quality, reliability, and schedule in production, Faraday assures seamless integration of multi-source dies, leading to project success.

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the successful qualification of Faraday’s Ariel™ IoT SoC with UMC’s 40nm ultra-low-power (40ULP) process. Exclusively offering the SONOS eFlash solution on UMC’s 40ULP, Faraday aims at AIoT, MCU, and smart grid projects that necessitate superior performance and low-power consumption.

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, launched its SerDes (serializer/deserializer) total solution comprises SerDes IP design on UMC 28nm and the corresponding IP advanced (IPA) service which includes IP subsystem integration, PHY hardcore implementation, and signal integrity/power integrity (SI/PI) analysis on the system with package and PCB design.

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced to offer multi-site manufacturing support across all regions for ASIC customers. With its long-term close collaboration with global foundry and OSAT vendors, Faraday is able to provide customers the multi-site support to mitigate manufacturing risks due to economy, accidents, epidemics, or geopolitics.

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced it has collaborated with Infineon to develop a SONOS eFlash platform on UMC’s 40uLP process. This platform includes a newly developed eFlash subsystem IP and complete eFlash testing solution with easy-to-integrate and fast data access features. This total solution facilitates customers to accelerate product development and utilize the flash memory technology more easily; meanwhile, it also simplifies SONOS eFlash testing with a built-in self-test (BIST) function to provide customers solid quality advantages.

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, announced that its FPGA-Go-ASIC™ service has successfully delivered variety of FPGA conversions including industrial, medical, smart grid, music instrument, and 5G wireless design applications ranging from 55nm to 22nm process nodes. The service has reduced the total BOM cost and power consumption of those projects significantly to enhance their market competitiveness; some of them were designed for fully pin-to-pin compatible with the existing FPGA chips.

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, announced its debut of its design implementation services for FinFET technology targeting all foundries. This flexible service leverages Faraday’s ASIC design experiences and resources to support global fabless houses, system houses, ASIC providers, and foundries who access advanced FinFET technology (8nm, 7nm, 5nm and beyond), provided by foundries in any designated section of IC design, for their short time-to-market and efficient resource allocation.

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced that its 14LPP application-specific IPs have been listed on SAFE™ (Samsung Advanced Foundry Ecosystem) IP system. These FinFET IPs, including LPDDR4/4X PHY, MIPI D-PHY, V-by-One, FPD-link, LVDS I/O, ONFI I/O, and memory compilers, are silicon proven and have already been integrated into the SoC project.

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today unveiled its FPGA-Go-ASIC™ prototyping platform solution. This solution consists of Faraday’s SoCreative!™ SoC platforms and optional FPGA prototyping platforms, providing customers a quick entry into the circuit development and system verification. Combined with its comprehensive FPGA-Go-ASIC service, Faraday is able to help customers enhance chip performance and also develop products more rapidly and cost-effectively.

Faraday Technology Corporation (TWSE: 3035), leading ASIC design service and IP provider, today introduced its new security subsystem named Soteria!™. The Soteria! solution provides a RoT (Root of Trust) mechanism for custom SoC designs, enabling hardware-level security to a range of IoT applications.

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, announced that its Gigabit Ethernet PHY has been silicon proven on UMC’s 28HPC+ process and is now available for new ASIC SoC designs and IP licensing. This new IP, based on 28nm node, provides the benefits of low power-consumption and high performance. Together with Faraday’s networking solutions, it can facilitate efficient development of a broad range of applications such as industrial switch, home gateway, xPON, smart home appliance, access layer switch, router, and factory automation.

Faraday Technology Corporation (TWSE: 3035), leading ASIC design service and IP provider, today launched SoCreative!VI™ A600 SoC development platform implemented in Samsung Foundry’s 14LPP FinFET process technology. This platform is equipped with Faraday’s A600 SoC chip on an evaluation board and the Linux software development kit (SDK) to create a full-performance system environment, enabling seamless functional verification and system software development in the early development stage. The A600 SoC platform can be used to shorten time-to-market for FinFET’s applications, including AIoT, edge computing, multimedia, and communication.

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced that it has successfully delivered multiple Factory Automation ASIC projects mainly in the field of industrial IoT (IIoT). These designs include applications of industrial automation controllers and communication, robots and PLC processors - implemented in 8” and 12” wafer process technologies. They brought long-term supply commitments to our customers while providing superior reliability to meet the industry requirements.

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, has received the certificate of ISO 26262 ASIL-D Ready from SGS-TÜV on its memory compilers, including SRAM and ROM, at UMC’s 55eFlash node. Faraday also offers GPIO fundamental elements compliant with ISO 26262 ASIL-D Ready at 55nm, MIPI PHY compliant with ASIL-B Ready at 40nm, and CAN controller for all nodes.

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the availability of its silicon proven MIPI D-PHY IP in Samsung Foundry 14LPC process technology. By delivering up to 2.5Gbps data rate per lane, this MIPI DSI and CSI-2 compliant D-PHY IP supports a broad range of high-performance display and camera applications, including image signal processors, ultra HD displays, projectors, pico-projectors, AR/VR/MR, wearables, 3D sensors, cameras, surveillance systems, and POS systems.

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced that total shipments of ARM based SoC designs have exceeded 550 million units. In recent years, the applications were mainly in the fields of Mobile, MCU, Smartgrid, IoT, Networking, Multi-Function Printers, Factory Automotion, Projector, POS System, and Surveillance Equipment in 55nm, 40nm, and 28nm process nodes.

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced that its SoReal!™ 2.0 Virtual Platform has been successfully deployed in an Industrial IoT ASIC project, enabling the SoC to run Linux within just a few days, which includes Linux drivers, ROM code, and security boot. By integrating VDKs (Virtualizer Development Kits) into the ASIC design and validation process, this SoReal! 2.0 virtual platform gives customers the ability to launch both virtual and FPGA-based prototypes allowing full system bring up long before silicon is available.

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced that it has successfully delivered 5G NR mmWave ASIC projects for small cell baseband/IF and RRU (Remote Radio Unit). These success cases vividly demonstrate Faraday’s capabilities in complex IC integration service and high-speed interface IP solutions for 5G networking applications.

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced its LPDDR4 and LPDDR4X combo PHY IP up to 4.2Gbps is now available in Samsung’s 14nm LPC process. The silicon proven solution provides smaller area, lower power, and high bandwidth for applications such as multi-media, AR/VR, AI edge computing, AIoT, IIoT, Robot, MFP, SSD, 5G and networking.

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced its 16G Programmable SerDes is now available in the UMC 28nm HPC+ process. The new SerDes solution supports multiple protocols of high speed interfaces common in today’s consumer and networking applications. The SerDes architecture eases PCB design and, in the case of PCIe Gen4, lowers BOM cost by reducing the retimer circuit requirements